Tue, Jan 29, 2008
to
Thu, Jan 31, 2008 |
WestPack 2008 |
A number of Trident's OEM customers exhibited at WestPack tradeshow in Anaheim, California on January29-31, 2008.
In particular, look for Matthews and ID Technologies among other Trident-Powered exhibitors at the show.
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Tue, Apr 8, 2008
to
Wed, Apr 9, 2008 |
Printed Electronics Europe ’08 |
Printed Electronics Europe is Europe's largest event on printed, thin film and organic electronics.
The conference features world class speakers - with many exclusives - and the largest exhibition on the topic, with more than 60 exhibitors.
The event also has six optional Masterclasses with numerous other activities co-located alongside. For those new to this sector or already involved, this is the must attend event. |
Mon, Apr 14, 2008
to
Tue, Apr 15, 2008 |
IMI Inkjet for Mfg. Symposium 2008 |
IMI's Ink Jet As A Manufacturing Symposium will focus on the commercialization of ink jet as a manufacturing process.
A wide range of experts will describe the processes and products they are commercializing, from a fundamental component level through to final products. They will describe how ink jet has the potential to offer substantial financial benefits to manufacturers or enables new levels of product performance. |
Wed, Apr 16, 2008
to
Fri, Apr 18, 2008 |
IMI Technology Suppliers Showcase 2008 |
IMI's Ink Jet Technology Suppliers Showcase is a unique program concept designed to enable current and potential ink jet printing system developers, integrators and users to obtain detailed technical information and establish professional working relationships with ink jet printing technology providers. |
Thu, Apr 24, 2008
to
Wed, Apr 30, 2008 |
InterPack 2008 |
Billed as the world’s "No. 1 fair for the [packaging] industry", the 2008 edition of Interpack promises to unveil innovative solutions and comprehensive services for all packaging sectors as well as the confectionery industry.
Interpack is synonymous with the future of packaging in all its facets, from individual or integrated process stages through intelligent/active packaging, innovative materials, improved quality controls and tooling engineered for flexibility to marketing-oriented design. |
